DZB - Zverejnená bakalárska práca

Štúdium vplyvu obsahu vlhkosti na tepelnú vodivosť smrekového dreva

Autor
Petrovaj, Adam
Školiteľ
Ružiak, Ivan
Oponent
Mračková, Eva
Škola
Technická univerzita vo Zvolene DF KFEAM (DF)
Rok odovzdania
2020
Počet strán
40.s
Trvalý odkaz - CRZP
https://opac.crzp.sk/?fn=detailBiblioForm&sid=F50A3640C856E51081E3B261DB62
Primárny jazyk
slovenčina

Typ práce
Bakalárska práca

Študijný odbor
9241 | záchranné služby

Dátum zaslania práce do CRZP
08.06.2020

Dátum vytvorenia protokolu
08.06.2020

Dátum doručenia informácií o licenčnej zmluve
10.07.2020

Práca je zverejniteľná od
ihneď

Elektronická verzia
 Stiahnuť prácu (pdf)
 Prehliadať
The bachelor's thesis deals with the research of the dependence of thermal conductivity on equilibrium moisture content in wood. The aim of this work is to demonstrate the applicability of extended dynamic plane source method for determining the thermophysical properties of wood and to verify whether the dependence of thermal conductivity on density can be described as a linear function of density. Based on experimental results and statistical parameters of the linear fit between density and moisture content i. e. thermal conductivity and density. The coefficient of variation in the determination of thermal conductivity does not exceed 14% with an average value below 10%, which is excellent repeatability. Correlation coefficient between thermal conductivity and density i. e. The density and moisture content is not less than 0.938 with a relative mean square error below 1.7%, so we can say that both theoretical models are valid. The importance of our work is the expansion of knowledge in the field of thermophysics of wood and changes in its thermophysical properties, more precisely thermal conductivity, by influence of moisture content in individual anatomical directions. At the same time, confirmation of the possibility of using the extended dynamic plane source method to determine the thermophysical properties of wood.

Verzia systému: 6.2.61.5 z 31.03.2023 (od SVOP)