DDP - Zverejnená diplomová práca

Vplyv fungicídov aplikovaných do MMF lepidla na odolnosť trieskových dosák voči plesniveniu

Autor
Hyšková, Veronika
Školiteľ
Reinprecht, Ladislav
Oponent
Neuschlová, Eva
Škola
Technická univerzita vo Zvolene DF KMTD (DF)
Rok odovzdania
2015
Počet strán
50s.. s
Trvalý odkaz - CRZP
https://opac.crzp.sk/?fn=detailBiblioForm&sid=63B76DDB09E75D01403BEC4D4D47
Primárny jazyk
slovenčina

Typ práce
Diplomová práca

Študijný odbor
3331 | *drevárstvo

Dátum zaslania práce do CRZP
04.05.2015

Dátum vytvorenia protokolu
05.05.2015

Dátum doručenia informácií o licenčnej zmluve
27.05.2015

Práca je zverejniteľná od
04.05.2018

Elektronická verzia
 Prehliadať
The aim of thesis is to examine the biological resistance of monolayer particleboard (PB) to selected species wood destroying moulds (Aspergillus niger, Penicillium brevicompactum) in terms of the effect of chemical protection antifungals (zinc oxide and copper sulfate). In the first phase chemical protection, we produced four types of 1-layer particleboard, glued melaminureaformaldehyd (MUF) adhesive, blended with antifungal substance zinc oxide at four different concentrations. The lowest resistance to Penicillium brevicompactum had untreated particle samples. Showed the best hand the resistance of samples treated with 12 and 24% share of zinc oxide. The lowest resistance to mold Aspergillus niger were untreated samples. High resistance treated samples showed 24% share of zinc oxide. In the second phase chemical protection, we produced four types of 1-layer particleboard, glued MUF adhesive. As additive copper sulfate were used in four different concentrations. The highest resistance to mold Penicillium brevicompactum samples were treated with 6% share of copper sulfate. Showed the lowest resistance of the untreated sample, without the addition of antifungal substance. Against Aspergillus niger had the best resistance samples treated with 6% share of copper sulfate. The lowest resistance samples were treated with only 2% of copper sulfate.

Verzia systému: 6.2.61.5 z 31.03.2023 (od SVOP)